2. FULL CONTROL-WORKSHOP
November 25th, 2009 in Munich (Germany)
For more information follow this link.

 

 

1) FULL CONTROL Motivation and Background

 

A common new characteristic of these developments is that they are based on an increasing convergence of semiconductor, packaging and sensor and actuator (MEMS) technologies as well as on using innovative nanotechnology-related material developments. While these new generations of “smart” micro systems provide superior performance properties and a much extended application potential, their high integration density and miniaturization level as well as their complexity in terms of involving different materials, technologies and components pose tremendous new challenges industrial manufacturing in terms of defect probabilities and reliability risks.

In this context, the "Full Control" project was launched to consider specifically the arising new failure analysis requirements that have to be met in order to secure the manufacturing quality of new smart micro systems and their reliability during application (compare e.g. SEMATECH white paper on analytics).

2) Aim of FULL CONTROL:

 

The Full Control project is pursuing a comprehensive and synergistic approach by bringing micro system and microelectronics manufacturers together with failure analysis tools providers and related research institutes, and to strengthen their strategic collaboration. The Full Control consortium will analyze defects and reliability risks relevant for selected new smart systems preferably during their development phase and will contribute to develop adequately adapted failure analysis tools and methods. Thus, Full Control project is aiming at contributions to secure quality and reliability of new complex micro systems and to prepare the failure analysis equipment manufacturers for the challenges in upcoming new future markets.

 

With respect to diagnostic and testing developments, the Full Control project considers selected innovative methods along the comprehensive methodical chain in failure diagnostics covering the subsequent steps of time-efficient failure localization and fault isolation, precise target preparation, and high-resolution analytics and material characterization. These improved tools and methods can be utilized by the micro system manufacturers both for a time-efficient development of high performance integrated systems as well as to secure their manufacturing yield and reliability during fabrication. Full Control is also trying to form a platform for this specific research field.